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Advanced Diamond micropowder

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HD-A (High Purity Diamond Micron Powder)


High-grade diamond is selected as raw material, the product crystal form is regular, the particle size is evenly distributed, and a special purification process is adopted to make the particle surface purer, and the total impurity content is controlled within 100PPM. It is suitable for cutting, grinding and polishing of high-end PCD, semiconductor wafer substrate materials, photovoltaic silicon materials, metal bonds, sintered products and high requirements.

HD-B (High Strength Diamond Micron Powder)


High-grade diamond is selected as raw material, the product crystal form is regular, the particle shape is equal area, the particle size distribution is concentrated, and the impurity content is low. It is suitable for efficient cutting, precision grinding and efficient polishing of metal bonds, ceramic bonds, electroplating products, precision machinery, optical glass, semiconductor wafer substrate materials and solar photovoltaic silicon materials.

HD-C (Excellent Diamond Micron Powder)


HOLD high-grade diamond is selected as raw material, with regular crystal form, concentrated particle size distribution, block structure and high wear resistance. It is suitable for making metal bonds, resin bonds and other products, and is used for cutting, grinding and polishing semiconductor wafer substrate materials, optical glass, gemstones and other products.

HD-D (Law strength & High Fragility Micron Powder)


Using RVD diamond as raw material, it is an economical product, with irregular crystal form, sharpness, good self-sharpening, and particle size distribution in line with national standards. It is suitable for cutting, grinding and polishing workpieces such as resin module products, ceramics, stones, semiconductor silicon materials and gemstones.