A high-tech enterprises concentrate on product development and technical innovation

Type

Description

Performance

Application

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HD-A High Purity Diamond Micro Powder We use high-grade diamond as raw material, the product crystal form is regular, the particle size distribution is uniform, and a special purification process is adopted to make the particle surface purer, and the total impurity content is controlled within 100PPM. It is suitable for cutting, grinding and polishing of poly wafers, semiconductor wafer substrate materials, photovoltaic silicon materials, metal bonds, sintered products and high requirements.

HD-B High Strength Diamond Micro Powder We use high-grade diamond as raw material, the product has a regular crystal shape, equal particle shape, concentrated particle size distribution,and low impurity content. It is suitable for efficient cutting, precision grinding and efficient polishing of metal bonds, vitrified bonds, electroplating products, precision machinery, optical glass, semiconductor wafer substrate materials and photovoltaic silicon materials.

HD-C Premium Grade Diamond Micro Powder

The crystal form is regular, the particle size distribution is concentrated, the particles are in a block structure, and the wear resistance is high. It is suitable for making metal bonds, resin bonds and other products.

It is used for cutting, grinding and polishing semiconductor wafer substrate materials, optical glass, gemstones and other products.

HD-D Low Strength Diamond Micro Powder

We use RVD diamond as raw material, economical product, irregular crystal form, sharper, good self-sharpening, particle size distribution in line with national standards.

It is suitable for cutting, grinding and polishing workpieces such as resin module products, ceramics, stones, semiconductor silicon materials and gemstones.

 

Available Particle Size Table Unit: μm
0-0.5 0-1 0.5-1 0.5-1.5 0-2
1-2 0.5-3 1-3 1.5-3 2-3
2-4 2-5 3-6 3-7 4-8
4-9 5-10 5-12 6-12 7-14
8-16 8-20 10-20 12-22 12-25
15-25 20-30 22-36 20-40 30-40
30-50 36-54 40-50 40-60 50-60

!Other particle sizes can be customized!
!Micron powder surfaces can be nickel-plated and chrome-plated!

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