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Super Fine Diamond micropowder(HD-A)

Brand:
HoldDiamond
Using high technology, high strength MBD series diamond as the raw material, the use of precision machining production procedures, product rules of crystal shape, spherical shape, particle size distribution and grinding particle concentration, particle high intensity, low impurity content, with excellent dispersibility, resistance to wear.
Product description

Suitable for cutting, grinding and polishing of organic and inorganic brittle materials. Such as: wire saws, wire saw, stone, and cutting tools, saw blades, semiconductor saw blade is also applicable to monocrystalline silicon, polycrystalline silicon, diamond, ruby, sapphire, quartz plate, LED < / span > sapphire substrates, liquid crystal glass, with high precision magnetic materials, semiconductor and other high-tech materials coarse grinding, fine grinding and polishing tools.

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