
Super Fine Diamond micropowder(HD-A)
Brand:
HoldDiamond
Product description
Suitable for cutting, grinding and polishing of organic and inorganic brittle materials. Such as: wire saws, wire saw, stone, and cutting tools, saw blades, semiconductor saw blade is also applicable to monocrystalline silicon, polycrystalline silicon, diamond, ruby, sapphire, quartz plate, LED < / span > sapphire substrates, liquid crystal glass, with high precision magnetic materials, semiconductor and other high-tech materials coarse grinding, fine grinding and polishing tools.
Keyword:
abrasive
micron powder
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