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HD-WX (Micron Powder Specialized for Diamond Wire)
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  • HD-WX (Micron Powder Specialized for Diamond Wire)

HD-WX (Micron Powder Specialized for Diamond Wire)

The selection of high-grade diamond raw materials, special shaping and grading process, has the characteristics of concentrated particle size, high strength, block structure of particles, and low impurity content. It is suitable for electroplating diamond wire and mortar cutting line, and efficient cutting of brittle materials such as photovoltaic silicon materials, semiconductor wafer materials, and sapphire.

Product description

The selection of high-grade diamond raw materials, special shaping and grading process, has the characteristics of concentrated particle size, high strength, block structure of particles, and low impurity content.

It is suitable for electroplating diamond wire and mortar cutting line, and efficient cutting of brittle materials such as photovoltaic silicon materials, semiconductor wafer materials, and sapphire.

Hold Diamond Standard Grit Size   Unit:μm
4-8 5-10 5-12 6-12 7-14
8-16 8-20 10-20 12-22 12-25
15-25 20-30 22-36 20-40 30-40
30-50 36-54 40-50 40-60 .

 

Other grit size can be customized!

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